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NanoScope-HPA™
NanoScope™ HPA (Hotspot Pattern Analyzer) provides powerful solutions for analysis and disposition of different types of violations found from design verifications to manufacturing process characterization and monitoring. Integrated in NanoScope™ pattern-centric DFM platform, HPA takes defect report from wafer and mask inspections, as well as hot-spot reports from OPC verification or layout process sensitivity checking. It allows fast and interactive viewing of hot-spot groups, design layout, and images directly from processed wafers or masks. Its unique pattern and cell extraction functions help users to quickly identify repeating patterns among large number of violations. Through sorting, filtering, regrouping and re-classification, HPA provides the guideline for effective review sampling and enables individual or group hot-spot disposition and tracking. The user-friendly GUI interface provides a common communication platform between different users and clients.
Features and Benefits:
- Easy input data format conversion and import with original groups or classifications
- User friendly GUI operation and multi-format, histogram based viewing, sorting and filtering
- Multi-level filtering, plotting and statistical analysis
- Flexible hotspot layout display with individual or group tile view, chip-map view and reference image overlay
- Defect location extraction in hierarchical cell view
- Exact pattern extraction/matching for effective defect grouping with user definable pattern size
- Increased pattern grouping efficiency with user definable pattern matching tolerances
- Unique pattern similarity pattern grouping with proprietary algorithm
- Advanced analysis functions capable of handling large amount of defect counts up to millions
- Advanced defect printability (CD, MEEF, NILS) check functions (requires lithography process model)
- Individual and group defect disposition and tracking
Multiple views of hot spot groups
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Image overlay with design data
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