Take line monitoring to the next level with Die-to-Database Pattern Monitor. Tap the full potential of SEM images in ways that redefine production line monitoring for advanced technology nodes.

Generate care areas for both Bright Field and E-Beam inspection tools using Anchor’s powerful pattern search, signature extraction, and net tracing engines. Optimize E-Beam recipes by fitting care areas into the fewest number of FOVs. Generate both macro and micro care areas.

After inspection, visualize, analyze, and subsample the inspection results with the aid of chip design files (GDS / OASIS) to convert streams of raw data into meaningful information. Address both production and PWQ/FEM needs.

Benefit from the collective experience of multiple teams in the fab by building a central defective pattern library and using it for pattern search, care area generation, risk analysis of new devices, comparison to OPC-simulated weak points, correlation with electrical fault analysis results, and other use cases.

NanoScope PRV is a model-based, pattern-centric full chip Post-RET/OPC verification software solution. It is a production-proven, distributed-computing application providing accurate lithography process modeling, comprehensive defect detection and analysis, and process window limiting pattern extraction.

Create your own custom solutions by integrating Anchor's powerful and vendor-neutral image processing technology for contour extraction, alignment, search, and defect detection. D2DB-Image Explorer provides a toolkit of functions that empower you to create elaborate solutions for your unique applications.

Apply Anchor's leading edge suite of exact, similar, and parametric pattern search; signature extaction; and net tracing technologies to produce effective and optimized Bright FIeld and E-Beam inspection care areas...including both macro and micro care areas.

After inspection, apply Anchor's flexible pattern grouping (exact, similar, center shift, dynamic radius), signature grouping, and sampling technologies to convert streams of raw data into meaningful information. Address both production and PWQ/FEM needs.

I2DC (Image to Design Contour) is a specialized tool for the OPC / Lithography engineer who needs to compare simulation with real silicon to analyze the OPC workflow and perform adjustments as needed. It provides powerful image processing features to help engineers identify the design intent. And advanced tools such as multi-layer handling and image stitching enable shot level analysis.